Siemens announces partnership with Arm to to help automakers deliver electronic design and automotive solutions
西门子宣布与Arm合作，帮助汽车制造商提供电子设计和汽车解决方案
January 7, 2020 - Siemens Digital Industries Software announced a partnership with global semiconductor IP company Arm, that will bring IP, methodologies, processes and tools together to help automakers, integrators and suppliers collaborate, design and bring to market their next-generation platforms. This partnership was formed to address the challenges facing the industry in developing platforms to realize active-safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles. The combination of Siemens’ and Arm’s technologies is intended to help automakers and suppliers deliver electronic design and automotive solutions.
2020年1月7日——西门子数字化工业软件公司与全球半导体IP公司Arm建立合作伙伴关系，把IP、方法、流程和工具整合在一起，帮助汽车制造商、集成商和供应商进行下一代平台的协同研发，并将其推向市场。这次合作旨在解决行业在开发平台上所面临的挑战，以实现主动安全、高级驾驶辅助、车载信息娱乐系统、数字驾驶舱、车到车/车到基础设施以及自动驾驶汽车需求。将西门子和Arm的技术相结合，可以帮助汽车制造商和供应商快速提供电子设计和汽车解决方案。
Siemens’ PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modeling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment.
搭配了Arm IP的西门子PAVE360数字双胞胎环境将高保真建模技术从传感器和集成电路应用于车辆动力学和车辆运行环境。通过Arm IP，包括具有功能安全支持的Arm汽车增强（AE）产品，数字双胞胎模型可以运行整个软件堆栈，从而提供早期的功率和性能指标，同时可以在车辆及其环境的高保真模型下运行。
Using Siemens’PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs, and understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built. Arm’s automotive IP is helping to democratize the ability to create safety-enabled silicon, bringing it within reach of the entire automotive supply chain. By rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs). This in turn reduces vehicle weight which can promote longer range electric vehicles.
通过将西门子PAVE360与Arm汽车IP结合，汽车制造商和供应商可以对子系统和片上系统（SoC）设计进行仿真和验证，并在建造车辆实体之前，从硅级别自下而上更好地掌握其在整车设计中的表现情况。Arm的汽车IP正在帮助普及安全硅的制造能力，从而使整个汽车供应链受益。通过重构汽车行业的IC设计，制造商可以合并电子控制单元（ECU）。这又减轻了汽车重量，从而增加电动汽车的行驶里程。
